All Tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
Status: Released
Drawing: H. Hansen
Scale: 1.25:1
Rev: B
Date: 4/16/04
Modified: 1/21/05
File: SS-BGA548C-01 Dwg
SS-BGA548C-01 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
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2
Customer's PCB
6
5
3
PAGE 1 of 4
Features
Directly mounts to target PCB (needs tooling
holes) with hardware
Minimum real estate required
Compression plate distributes evenly
Clamshell lid
Compression Plate: Black anodized 7075 Aluminum.
Thickness = 12 mm.
Compression Screw: Clear anodized 7075 Aluminum.
Height = 27 mm, Fluted Knob
Pogo Pin:
Plungers - Hardened Steel/ Gold plated
Barrel - Copper Alloy/ Gold plated
Spring - Stainless Steel/ Gold wire
Pogo Pin Guides: Ultem 1000.
Socket Base: Black anodized 7075 Aluminum.
Height = 6 mm.
Clam Shell Lid: Black anodized 7075 Aluminum.
Height = 20 mm.
Socket Base Screw: Socket Head Cap Screw, 18-8
SS, 0-80 Thread, 3/4" long.
Backing Plate: Black anodized 7075 Aluminum
Insulation Plate: FR4/G10
1
Materials:
2
3
4
5
6
7
8
9
Pogo Pin Guide Screw: Pan head phillips, 18-8 SS,
0-80 thread, 3/16" long.
4
8
9
10
7
Latch: Black anodized 7075 Aluminum.
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11
11
Top View
Side View
A
A
(Section AA)
49.225mm
[1.938"]
42.60mm
[1.677"]
Assembled 38mm
+ IC thickness
PAGE 2 of 4
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Recommended PCB Layout
Top View
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
Status: Released
Drawing: H. Hansen
Scale: 3:1
Rev: B
Date: 4/16/04
Modified: 1/21/05File: SS-BGA548C-01 Dwg
SS-BGA548C-01 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Target PCB Recommendations
Total thickness: 1.5mm min.
Plating: Gold or Solder finish
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Socket Size
Orientation Mark
32.225mm
±0.125mm
1.00mm typ.
Mounting Hole
Ø 1.61mm
±0.05mm(x4)
29.725mm Sqr.
Ø 0.850mm
-
0.000mm
0.025mm
(x2)
Ø 0.51mmPAD
32.600mm
±0.125mm
2.72mm
5.08mm
6.33mm
±0.13mm
7.58mm
±0.13mm
22.105mm
34.725mm
±0.125mm Sqr.
2.50mm
±0.13mm
1.25mm
±0.13mm
2.74mm*
Backing Plate Size
25.00mm(x2)
PAGE 3 of 4
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
Status: Released
Drawing: H. Hansen
Scale:
Rev: B
Date: 4/16/04
Modified: 1/21/05
File: SS-BGA548C-01 Dwg
SS-BGA548C-01 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
D
E
Y
X
Ø0.25
Ø0.10
Z X Y
Øb
3
TOP VIEW
SIDE VIEW
3
4
5
Dimensions are in millimeters.
Interpret dimensions and toleraces per ASME
Y14.5M-1994.
Dimension b is measured at the maximum
solder ball diameter, parallel to datum plame Z.
Datum Z (seating plane) is defined by the
spherical crowns of the solder balls.
Parallelism measurement shall exclude any
effect of mark on top surface of package.
1.
2.
Compatible BGA Spec
0.20
BOTTOM VIEW
DIM MIN MAX
A
3.5
A1 0.4
0.6
b 0.70
D
E
e
27.00 BSC
27.00 BSC
1.0 BSC
e
26x26 Array
DETAIL
A
A1
DETAIL
0.2 Z
Z
0.20 Z
5
4
