Fremont Micro Devices FT24C02A
© 2009 Fremont Micro Devices Inc. DS3011B-page1
Two-Wire Serial EEPROM
2K (8-bit wide)
FEATURES
Low voltage and low power operations:
FT24C02A: VCC = 1.8V to 5.5V, Industrial temperature range (-40℃ to 85℃).
Two Versions of FT24C02A:
FT24C02A-5xx: Low cost with 5 valid pins. Suitable for most application except those with
more than one EEPROM on the same IIC Bus. Details in the “Device Addressing” section.
FT24C02A-Uxx: 8 valid pins suitable for all application.
Maximum Standby current < 1µA (typically 0.02µA and 0.06µA @ 1.8V and 5.5V respectively).
16 bytes page write mode.
Partial page write operation allowed.
Internally organized: 256 × 8 (2K).
Standard 2-wire bi-directional serial interface.
Schmitt trigger, filtered inputs for noise protection.
Self-timed programming cycle (5ms maximum).
1 MHz (5V), 400 kHz (1.8V, 2.5V, 2.7V) Compatibility.
Automatic erase before write operation.
Write protect pin for hardware data protection.
High reliability: typically 1, 000,000 cycles endurance.
100 years data retention.
Standard 8-pin PDIP/SOIC/TSSOP/DFN and 5-pin SOT-23/TSOT-23 Pb-free packages.
DESCRIPTION
The FT24C02A is 2048 bits of serial Electrical Erasable and Programmable Read Only Memory,
commonly known as EEPROM. They are organized as 256 words of 8 bits (1 byte) each. The devices
are fabricated with proprietary advanced CMOS process for low power and low voltage applications.
These devices are available in standard 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-lead DFN
and 5-lead SOT-23/TSOT-23 packages. A standard 2-wire serial interface is used to address all read
and write functions. Our extended V
CC
range (1.8V to 5.5V) devices enables wide spectrum of
applications.
FT24C02A
ABSOLUTE MAXIMUM RATINGS
Industrial operating temperature: -40℃ to 85℃
Storage temperature: -50℃ to 125℃
Input voltage on any pin relative to ground: -0.3V to V
CC
+ 0.3V
Maximum voltage: 8V
ESD protection on all pins: >2000V
* Stresses exceed those listed under “Absolute Maximum Rating” may cause permanent damage to the
device. Functional operation of the device at conditions beyond those listed in the specification is not
guaranteed. Prolonged exposure to extreme conditions may affect device reliability or functionality.
Figure 2: Block Diagram
© 2009 Fremont Micro Devices Inc. DS301
1B-page3
